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Specifications: Product Collection Intel® Xeon® E Processor Code Name Products formerly Coffee Lake Vertical Segment Server Processor Number E-2236 Lithography 14 nm
Performance: # of Cores 6 # of Threads 12 Processor Base Frequency 3.40 GHz Max Turbo Frequency 4.80 GHz Cache 12 MB TDP 80 W
Memory Specifications: Max Memory Size (dependent on memory type) 128 GB Memory Type DDR4-2666 Max # of Memory Channels 2 ECC Memory Supported ‡ Yes
Processor Graphics: Processor Graphics ‡ N/A Graphics Output N/A 4K Support No Max Resolution (HDMI 1.4)‡ N/A Max Resolution (DP)‡ N/A Max Resolution (eDP - Integrated Flat Panel)‡ N/A Max Resolution (VGA)‡ N/A DirectX* Support N/A OpenGL* Support N/A Intel® Quick Sync Video No Intel® InTru™ 3D Technology No Intel® Clear Video HD Technology No Intel® Clear Video Technology No Device ID N/A
Expansion Options: Scalability 1S Only PCI Express Revision 3.0 PCI Express Configurations ‡ 1x16,2x8,1x8+2x4 Max # of PCI Express Lanes 16
Package Specifications: Sockets Supported FCLGA1151 Max CPU Configuration 1 TCASE 73°C TJUNCTION 100 Package Size 37.5 mm x 37.5 mm
Product description
INTEL 6-core Xeon E-2236 3.4GHZ/12MB/FCLGA1151/80W
Specifications:
Product Collection Intel® Xeon® E Processor
Code Name Products formerly Coffee Lake
Vertical Segment Server
Processor Number E-2236
Lithography 14 nm
Performance:
# of Cores 6
# of Threads 12
Processor Base Frequency 3.40 GHz
Max Turbo Frequency 4.80 GHz
Cache 12 MB
TDP 80 W
Memory Specifications:
Max Memory Size (dependent on memory type) 128 GB
Memory Type DDR4-2666
Max # of Memory Channels 2
ECC Memory Supported ‡ Yes
Processor Graphics:
Processor Graphics ‡ N/A
Graphics Output N/A
4K Support No
Max Resolution (HDMI 1.4)‡ N/A
Max Resolution (DP)‡ N/A
Max Resolution (eDP - Integrated Flat Panel)‡ N/A
Max Resolution (VGA)‡ N/A
DirectX* Support N/A
OpenGL* Support N/A
Intel® Quick Sync Video No
Intel® InTru™ 3D Technology No
Intel® Clear Video HD Technology No
Intel® Clear Video Technology No
Device ID N/A
Expansion Options:
Scalability 1S Only
PCI Express Revision 3.0
PCI Express Configurations ‡ 1x16,2x8,1x8+2x4
Max # of PCI Express Lanes 16
Package Specifications:
Sockets Supported FCLGA1151
Max CPU Configuration 1
TCASE 73°C
TJUNCTION 100
Package Size 37.5 mm x 37.5 mm
Advanced Technologies:
Intel® Optane™ Memory Supported ‡ Yes
Intel® Turbo Boost Technology ‡ 2.0
Intel® vPro™ Platform Eligibility ‡ Yes
Intel® Hyper-Threading Technology ‡ Yes
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes
Intel® VT-x with Extended Page Tables (EPT) ‡ Yes
Intel® TSX-NI Yes
Intel® 64 ‡ Yes
Instruction Set 64-bit
Instruction Set Extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Thermal Monitoring Technologies Yes
Security & Reliability:
Intel® AES New Instructions Yes
Secure Key Yes
Intel® Software Guard Extensions (Intel® SGX) Yes with Intel® ME
Intel® Memory Protection Extensions (Intel® MPX) Yes
Intel® OS Guard Yes
Intel® Trusted Execution Technology ‡ Yes
Execute Disable Bit ‡ Yes
Intel® Boot Guard Yes
Bussines information
Discomp s.r.o., +420 377 221 177, sales@discomp.cz