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Popis produktu: Tepelná kompozice (mazivo) pro chladiče Pomáhá rozptylu tepla z CPU, čipové sady nebo procesoru na chladič Vynikající tepelná impedance Dokonalá stabilita - nebude se oddělovat, nespouštět, migrovat ani krvácet Kapacitní nebo elektricky vodivé
Weight: 1.5 g Color: grey Thermal conductivity: > 4.5 W / mK Thermal Impedance <0.205 ° C-in2 / W Density: > 2.5 Evaporation: <0.001 % Volatility: <0.005 % The dielectric constant: > 5.1 Dissipation Factor: <0.005 Viscosity: 76 CPS Thixotropic index: 310 ± 10 ° C Operating Temperature: -50 ~ 240 ° C Composites: 50% silicone compounds Compounds: 30% of carbon The compounds of metal oxides: 20%
Product description
Popis produktu:
Tepelná kompozice (mazivo) pro chladiče
Pomáhá rozptylu tepla z CPU, čipové sady nebo procesoru na chladič
Vynikající tepelná impedance
Dokonalá stabilita - nebude se oddělovat, nespouštět, migrovat ani krvácet
Kapacitní nebo elektricky vodivé
Weight: 1.5 g
Color: grey
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 ° C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ± 10 ° C
Operating Temperature: -50 ~ 240 ° C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%
Bussines information
Discomp s.r.o., +420 377 221 177, sales@discomp.cz